Shenzhen International Electronics & Embedded Expo (elexcon) China 2026 will take place from September 9 to 11, 2026, at the Shenzhen World Exhibition & Convention Center in Bao’an, Shenzhen. The annual event focuses on electronics, semiconductors, embedded systems, components, optical communications, and end-device technologies. Its exhibition scope includes embedded and edge artificial intelligence, memory products, SoC, MCU and MPU technologies, wireless systems, MEMS sensors, power management integrated circuits, power devices, industrial power supplies, passive components, and advanced semiconductor packaging solutions such as SiP and Chiplet.
The event is designed for hardware developers, engineers, component suppliers, procurement managers, manufacturers, system integrators, and technology decision-makers working across the automotive, communications, consumer electronics, data centre, medical, industrial, and Internet of Things sectors. Its conference programme covers embedded technologies, integrated circuit packaging, automotive electronics, artificial intelligence, and developer applications. elexcon 2026 will be held alongside the China International Optoelectronic Exposition and the International Integrated Circuit Innovation Exposition.
