INTERCON 2026 Peru

INTERCON 2026 – 33rd International Conference on Electronics, Electrical Engineering and Computing will take place in Trujillo, Peru, bringing together researchers, engineers, students, and technology professionals working across electronics, computing, and electrical engineering disciplines. Organized by the IEEE Peru Section in collaboration with Universidad Privada Antenor Orrego (UPAO) and the IEEE UPAO Student Branch, the conference continues its long-standing focus on technical knowledge exchange and applied research. The 2026 edition will center on emerging technologies inspired by IEEE Future Directions initiatives, highlighting areas connected to digital transformation, intelligent systems, automation, and next-generation engineering solutions. The program is expected to include oral technical presentations, academic discussions, and collaborative sessions designed to encourage interaction between academia and industry. INTERCON 2026 also provides an opportunity for participants to present ongoing research, explore international collaborations, and follow recent developments shaping the future of engineering and computing technologies in Latin America and beyond.